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Services

The R&D Eeng Limited company has extensive expertise in the following areas​:

Specification Analysis

  • Requirement analysis

  • System analysis and decomposition

  • Requirement analysis based on functional safety (ISO26262)

  • DFT: Design for testing

  • DFM: Design for manufacturing

  • Design based on EMC requirements

Prototype Manufacturing

  • Prototype building and manufacturing  incorporation with our high-quality suppliers

  • Prototype startup and measurements 

Agile based Development

  • The company follows the V-model development model extended with the Agile methodology where applicable.

  • Testing of the product is planned in parallel with a corresponding phase of development. This method helps to implement the testing functionality into the design.

  • Overall Project plans are created (in MS Project 2016)

  • Development cycles follows the  scrum sprint methodology

Electronics Design and Analysis

​Schematic & Layout design in Altium Designer.
VHDL, Verilog design in Xilinx ISE.

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  • Analogue, digital and mixed signal design

  • DC / DC switching mode converters

  • 3 phase Motor Drivers

  • Embedded microprocessor and microcontroller systems

  • FPGA / CPLD Design

  • High speed Gbit communication

  • Electronic circuit simulation (behavior, signal integrity, thermal, power integrity)

  • Schematic drawing and review

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Analysis:

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  • WCCA: Worst Case Circuit Analysis (in Mathcad software)

  • CC/CM: Common Cause / Common Mode failure analysis

  • FSA:     Functional safety analysis (ISO26262)

  • FTA:     Failure Tree Analysis

  • FMEA:   Failure Mode Effect Analysis

  • SPICE:  Electronic circuit behavior simulation

  • SI:         Signal integrity analysis (on electronic circuit and/or Layout)

  • TI:         Thermal integrity analysis (on electronic circuit and/or Layout)

  • PI:         Power integrity analysis (on Layout)

  • EMC:     EMC requirements based analysis (on electronic circuit and/or Layout)

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Layout:

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  • Component placement recommendation, optimisation

  • High density design with micro-via technology

  • Flexible board design

  • Embedded components to PCB

  • Impedance controlled design

  • Power integrity

  • Thermal management

  • Layout EMC review

  • Printed circuit board design

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Mechanical Design and Analysis

Component development in I-Deas,  Fusion 360, Solidworks, Catia V5 environments

 

  • FEA:     Finite Element Analysis

  • CFDC: Computational Fluid Dynamic Calculation

  • CD:      Coupled Physics (CFD, Thermal & FEA) analysis

  • HCFC: High Cycle Fatigue Calculation (based on FKM Guideline)

  • WSC:   Weld Seam Calculation (according to Eurocode 3 and BS7608, DS 952 01, DVS 0705)

  • LCFC:  Low Cycle Fatigue Calculation

  • TMFC:  Thermo-mechanical Fatigue Calculation (based on Sehitoglu approach)

  • CHMC: Composite and Hyperelastic Material based Calculation

  • BJC:     Bolt Joints calculation (according to VDI2230, VDI2229)

  • FHRA:  Forced Harmonic Response Analysis (based on measurement, FFT, PSD excitation.)

  • PVC:    Pressure Vessel Calculation (according to AD2000 code)

  • NVHC:  Noise Vibration and Harshness calculation

    • (to mitigate, optimize noise and vibration characteristic of Structural components, covers such as Engine housing, Gearboxes, Engine NVH covers.)

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